Abstract
The Ultrasonic Polar Scan (UPS) is a novel method to determine the viscoelastic properties of materials by insonifying a single material spot from various incidence angles ?(?,?) and analyzing the reflected or transmitted response. In order to create a portable UPS device, it is investigated whether a cylindrically focused transducer can be employed to activate many incident angles ?? at once, together with a Circular Phased Array (C-PA) to capture the reflected field. A numerical model which is based on the decomposition of harmonic ultrasonic fields into its plane wave components is used together with an analytical model treating the plane wave-plate interaction in 3D. Afterwards, the complete reflected field can be reconstructed from the various reflected plane wave components. The reflected field data captured by the C-PA have been used in a post-processing procedure based on Fourier Transforms to determine plane wave reflection coefficients. The incident field produced by the proposed setup has been simulated, as well as its interaction with a unidirectional Carbon/Epoxy plate, after which the acquired data has been post-processed. In general, the plane wave reflection coefficient were retrieved with a high accuracy for a broad range of incident angles ?? in a single measurement if the lateral width of the C-PA elements is large enough. However, for higher frequency ranges, aliasing effects disturb the result significantly. This problem can be circumvented using multiple emitters with a smaller angular coverage, properly treating the data related to these emitters separately, and subsequently merging the results of these individual emitters.
How to Cite:
Daemen, J. ., Martens, A. ., Delrue, S. ., Van Den Abeele, K. ., Kersemans, M. ., Verboven, E. ., Van Paepegem, W. ., Daemen, J. ., Martens, A. ., Delrue, S. ., Van Den Abeele, K. ., Kersemans, M. ., Verboven, E. . & Van Paepegem, W. ., (2019) “3D simulations of a phased array based utrasonic polar scan system”, Review of Progress in Quantitative Nondestructive Evaluation .
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