Abstract
Cold electronics has become a key technology in many areas of science and technology including space exploration programs and particle physics. A major experiment with a very large number of analog and digital electronics signal processing channels to be operated at cryogenic temperatures is the next generation neutrino experiment, the Deep Underground Neutrino Experiment (DUNE). The DUNE detector uses liquid Argon at 87K as a target material for neutrinos. The DUNE electronics [1] consists of custom-designed ASIC (Application Specific Integrated Circuits) chips based on low power 180 nm-CMOS technology. The main risk for this technology is that the electronics components will be immersed in liquid argon for many years (20-30 years) without access. Reliability issues of ASICs may arise from thermal stress, packaging and manufacturing related defects: if undetected those could lead to long-term reliability and performance problems. The scope of this paper is to explore non-destructive evaluation techniques for their potential use in a comprehensive quality control process for during prototyping, testing and commissioning of the DUNE cold electronics system.
How to Cite:
Poonthottathil, N., Krennrich, F., Eisch, J., Weinstein, A., Bond, L. J., Barnard, D., Zhang, Z. & Koester, L., (2019) “Reliability studies of application specific integrated circuits operated at cryogenic temperature”, Review of Progress in Quantitative Nondestructive Evaluation .
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